Application of the ultrasonic pulse-echo technique for quality control of the multi-layered electronic components
Keywords:quality control, electronic component, delamination defect, signal processing.
AbstractThe objective of the presented work was enhancement of quality of ultrasonic images of electronic components, obtained by the pulse-echo ultrasonic technique. For this purpose a novel signal processing method based on the adaptive ultrasonic numerical model of the electronic device and selection of the appropriate time and frequency regions has been proposed
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